AI Vision Systems for Semiconductor Yield Enhancement 
In semiconductor manufacturing, maximizing yield is everything. Flexible Vision delivers AI-powered inspection systems that detect sub-micron defects and process variations invisible to the human eye. From front-end wafer fabrication to back-end packaging, our solutions provide the precision and data needed to improve your yield and ensure product reliability.
Precision Inspection for Fab 
& Assembly Applications
Core benefits for your semiconductor line:
- Maximize Yield: Catch process deviations and microscopic defects early to reduce scrap and improve the number of good dies per wafer.
- Cleanroom Compliant Integration: Deploy our systems safely within ISO-certified cleanroom environments without compromising sterility or interfering with laminar flow.
- Multi-Spectrum Imaging Ready: Integrate with your existing visible light, infrared (IR), and X-ray camera systems to uncover different types of sub-surface defects.
- Rapid Deployment & Retraining: Quickly adapt inspection models for new products or process nodes with minimal downtime, accelerating your time-to-market.
Key inspection applications include:
- Wafer Surface Defect Detection
- Post-Dicing Die Crack & Chip Inspection
- Wire Bond Integrity & Placement Analysis
- IC Package & Substrate Inspection
- Solder Ball & Bump Defect Detection
Our systems provide the actionable data needed to not only identify defects but also to perform root cause analysis, helping you fine-tune your fabrication and assembly processes for continuous improvement.
If you are ready to learn how Flexible Vision can integrate with your semiconductor manufacturing process, reach out to one of our engineers today. We are prepared to help you find the best machine vision solution for your needs.
Other industries we serve:
Increase Your Yield & Control
Your Manufacturing Process
Leverage the power of AI to achieve unparalleled precision and quality in your semiconductor line.
Discuss Your Application With an Engineer